American microelectronics data annual. 1964-65 by G. W. A. Dummer, J. Mackenzie Robertson

By G. W. A. Dummer, J. Mackenzie Robertson

American Microelectronics information Annual 1964-65 offers accomplished info on various microelectronics on hand within the U.S.

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Information Current = ±200 ma. Sense Output Signal = 5 mV ( with word drive current of t amp. 05 µ,sec rise time ) 5. Waveforms - Word Drive (Top ) , Information ( Middle) And Sense Signal ( Bottom ) . PROD UCT I N FORMATION There are presently two types of Thin Film Memory Planes commercially available. Each offers specific ad­ vantages which relate to their bit density and cost. Fig. 7. Outline Drawing. Accessories Three types of printed circuit receptacles are used with the memory. They are the following : THE TH I N FILM M E M O RY PLA N E TYPE B I P -1 000 The Type BIP-1 000 is a unit which can store 20 words, 8 bits each, for a total of 1 60 bits of information.

06 +3. 1 0 1 0 . 00 + 6 . 00 + 0 . 08 2 . 50 + 0. 65 2 . 50 5 . 00 - 4 . 00 OK - 0. 0 1 3 . 00 OK + 0. 1 3 3 . 00 OK + 0. 25 3 . 02 3 . 00 OK + 0. 25 3 . 00 OK + 0. 6. 96 + 2. 0 1 1 0. 6. 1 3) Test Vol tage (VDC) 3 Change M I L Spec SHOCK : I I + 0 . 6) + 0. 00 + l l . 4) V . C . 6 . 1 8) Conti nu i ty 3 Change M I L Spec (%) 51 Continued. CENTRALAB 1PEC 1a Data continued. SOME FACT S ON CENTRALAB 'PEC •a ( IN Q UESTION-AND-ANSWER FORM ) What types of capacitors may What are the standard coatings that are furnished on be included In PEC's!

0 5. 0 50 5. 0 0. 20 5 5 1. 0 5. 0 7. 0 s. o 1. 0 6 5 1. 0 s. 0 s. o 1. 0 1 5 1. 0 5. 0 5 5 1. 0 1. 0 5 CONNECTION CONNECTION 5 Vdc 6 2 ~ TYPE I - AMPLIFIER WAFER MAXIMUM RATINGS Connection No. ~ Manufacture r . Bendix Semiconductor Divi sion, Holmdel, New Jers ey. 38 BUNKER-RAMO THIN-FILM HYBRID MICROCIRCUITS Precision, low - c o st thin-film hybrid mic ro - c i rcuits now are available The Bunke r-Ramo Corporation as a re sult of recent technological advanc e s incorporated into the Company ' s mi c roelectronic production fac ility.

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