By G. W. A. Dummer, J. Mackenzie Robertson
American Microelectronics information Annual 1964-65 offers accomplished info on various microelectronics on hand within the U.S.
summary: American Microelectronics facts Annual 1964-65 presents entire details on various microelectronics to be had within the U.S
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Extra info for American microelectronics data annual. 1964-65
Information Current = ±200 ma. Sense Output Signal = 5 mV ( with word drive current of t amp. 05 µ,sec rise time ) 5. Waveforms - Word Drive (Top ) , Information ( Middle) And Sense Signal ( Bottom ) . PROD UCT I N FORMATION There are presently two types of Thin Film Memory Planes commercially available. Each offers specific ad vantages which relate to their bit density and cost. Fig. 7. Outline Drawing. Accessories Three types of printed circuit receptacles are used with the memory. They are the following : THE TH I N FILM M E M O RY PLA N E TYPE B I P -1 000 The Type BIP-1 000 is a unit which can store 20 words, 8 bits each, for a total of 1 60 bits of information.
06 +3. 1 0 1 0 . 00 + 6 . 00 + 0 . 08 2 . 50 + 0. 65 2 . 50 5 . 00 - 4 . 00 OK - 0. 0 1 3 . 00 OK + 0. 1 3 3 . 00 OK + 0. 25 3 . 02 3 . 00 OK + 0. 25 3 . 00 OK + 0. 6. 96 + 2. 0 1 1 0. 6. 1 3) Test Vol tage (VDC) 3 Change M I L Spec SHOCK : I I + 0 . 6) + 0. 00 + l l . 4) V . C . 6 . 1 8) Conti nu i ty 3 Change M I L Spec (%) 51 Continued. CENTRALAB 1PEC 1a Data continued. SOME FACT S ON CENTRALAB 'PEC •a ( IN Q UESTION-AND-ANSWER FORM ) What types of capacitors may What are the standard coatings that are furnished on be included In PEC's!
0 5. 0 50 5. 0 0. 20 5 5 1. 0 5. 0 7. 0 s. o 1. 0 6 5 1. 0 s. 0 s. o 1. 0 1 5 1. 0 5. 0 5 5 1. 0 1. 0 5 CONNECTION CONNECTION 5 Vdc 6 2 ~ TYPE I - AMPLIFIER WAFER MAXIMUM RATINGS Connection No. ~ Manufacture r . Bendix Semiconductor Divi sion, Holmdel, New Jers ey. 38 BUNKER-RAMO THIN-FILM HYBRID MICROCIRCUITS Precision, low - c o st thin-film hybrid mic ro - c i rcuits now are available The Bunke r-Ramo Corporation as a re sult of recent technological advanc e s incorporated into the Company ' s mi c roelectronic production fac ility.