By K. L. Mittal, Tanweer Ahsan
This finished ebook will offer either basic and utilized points of adhesion relating microelectronics in one and simply available resource. one of the themes to be lined include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of fabrics because it relates to adhesion
- Surface cleansing because it relates to adhesion
- Ways to enhance adhesion
- Unraveling of interfacial interactions utilizing an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to varied substrates
- Adhesion of skinny films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of alternative dielectric materials
- Delamination and reliability concerns in packaged devices
- Interface mechanics and crack propagation
- Adhesion size of skinny movies and coatings
Read Online or Download Adhesion in Microelectronics PDF
Best microelectronics books
The ebook is in fresh strong situation. Pages have water mark from prior. another way , it's a fresh replica.
This can be the 3rd version of the ecu Workshop on Microelectronics schooling (EWME). A steady-state regime has now been reached. a world group of collage academics is constituted; they alternate their adventure and their pedagogical instruments. They talk about the simplest how one can move the quickly altering thoughts to their scholars, and to introduce them to the hot actual and mathematical thoughts and types for the leading edge innovations, units, circuits and layout equipment.
This publication discusses the development blocks of digital circuits - the microchips, transistors, resistors, condensers, and so on, and the forums that aid them - from the viewpoint of mechanics: What are the stresses that consequence from thermal enlargement and contraction? What are the elastic parameters that confirm no matter if an element will live on a definite acceleration?
Discovery of one-dimensional fabric carbon nanotubes in 1991 through the japanese physicist Dr. Sumio Iijima has led to voluminous learn within the box of carbon nanotubes for various purposes, together with attainable substitute of silicon utilized in the fabrication of CMOS chips. One fascinating function of carbon nanotubes is that those may be steel or semiconducting with a bandgap counting on their diameter.
- Embedded Systems Design, Second Edition
- Beyond CMOS Nanodevices 1
- Nano and Molecular Electronics Handbook
- Nonthermal plasma chemistry and physics
- Design of system on a chip : devices & components
Additional info for Adhesion in Microelectronics
A. F. Diaz, U. Hetzler, and E. Kay, Inelastic electron tunneling spectroscopy of a chemically modified surface, J. Am. Chem. , 99, 6780–6781 (1977). T. Furukawa, N. K. Eib, K. L. Mittal, and H. R. , Inelastic electron tunneling spectroscopic study of the silane coupling agents: 1— Aminophenyltrimethoxysilane adsorbed on plasma grown aluminum oxide and effects of high humidity, Surf. , 4, 240–244 (1982). T. Furukawa, N. K. Eib, K. L. Mittal, and H. R. , Inelastic electron tunneling spectroscopic study of the silane coupling agents II.
R. , 63, 105–109 (2009). W. Suetaka, Surface Infrared and Raman Spectroscopy: Methods and Applications, Plenum Press, New York (1995). C. J. Adkins and W. A. Phys. , 18, 1313–1346 (1985). M. Higo, T. Miake, M. Mitsushio, T. Yoshidome, and Y. Ozono, Adsorption and deposition of anthraquinone-2-carboxylic acid on alumina studied by inelastic electron tunneling spectroscopy, infrared reﬂection absorption spectroscopy, X-ray photoelectron spectroscopy, and atomic force microscopy, Appl. , 254, 3829–3838 (2008).
Figure reproduced from reference  by permission of the Society for Applied Spectroscopy. compounds is described fully in the seminal book by Plueddemann  and in a comprehensive series of volumes by Mittal [49, 50, 51, 52, 53]. Mittal and coworkers also used IETS to investigate the effect of high relative humidity and exposure time on the silane/alumina interface [13, 14] which is of significant practical importance in the field of adhesion since adhesive joints are often exposed to water, in liquid or vapor form, in actual working environments.